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EP20K30EFC256-1

EP20K30EFC256-1

EP20K30EFC256-1

Intel

FPGAs APEX-20KE? Series 256-BGA

SOT-23

EP20K30EFC256-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of Logic Elements/Cells 1200
Total RAM Bits 24576
Number of Gates113000
Number of LABs/CLBs 120
In-Stock:3556 items

EP20K30EFC256-1 Product Details

EP20K30EFC256-1 Overview


Fpga chips is supplied in the 256-BGA package. To form a fundamental building block, there are 1200 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. The FPGA belongs to the APEX-20KE? series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In order to save space, this FPGA model has been contained in Tray. Fpga electronics is worth mentioning that this device provides 24576 bfpga electronics s of RAM. A total of 120 LABs/CLBs make up this FPGA array. As a basic building block, fpga semiconductor consists of 113000 gates. The device package supplied by 256-FBGA (17x17) is one of its suppliers.

EP20K30EFC256-1 Features


Up to 24576 RAM bits

EP20K30EFC256-1 Applications


There are a lot of Intel EP20K30EFC256-1 FPGAs applications.

  • Military DSP
  • High Performance Computing
  • Scientific Instruments
  • Space Applications
  • Aircraft navigation
  • Software-defined radios
  • Data Center
  • Industrial,Medical and Scientific Instruments
  • Audio
  • Bioinformatics

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