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EP20K200EFC484-2AB

EP20K200EFC484-2AB

EP20K200EFC484-2AB

Intel

FPGAs APEX-20KE? Series 484-BBGA

SOT-23

EP20K200EFC484-2AB Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 376
Number of Logic Elements/Cells 8320
Total RAM Bits 106496
Number of Gates526000
Number of LABs/CLBs 832
In-Stock:4192 items

EP20K200EFC484-2AB Product Details

EP20K200EFC484-2AB Overview


As part of the 484-BBGA package, it is included. A total of 376 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 8320 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 1.71V~1.89V . The FPGA belongs to the APEX-20KE? series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. There is an FPGA model contained in Tray in order to conserve space. This device has 106496 RAM bits, which is the number of RAM bits that this device offers. This FPGA is built as an array of 832 LABs/CLBs. 526000 gates make up the basic block of its construction. This device package is supplied by 484-FBGA (23x23).

EP20K200EFC484-2AB Features


376 I/Os
Up to 106496 RAM bits

EP20K200EFC484-2AB Applications


There are a lot of Intel EP20K200EFC484-2AB FPGAs applications.

  • Aircraft navigation
  • ASIC prototyping
  • Military DSP
  • Device controllers
  • Audio
  • ADAS
  • Medical ultrasounds
  • Industrial IoT
  • Data center hardware accelerators
  • Security systems

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