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EP20K200EF484C3NGZ

EP20K200EF484C3NGZ

EP20K200EF484C3NGZ

Intel

FPGAs APEX-20KE? Series 484-BBGA

SOT-23

EP20K200EF484C3NGZ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 376
Number of Logic Elements/Cells 8320
Total RAM Bits 106496
Number of Gates526000
Number of LABs/CLBs 832
In-Stock:4614 items

EP20K200EF484C3NGZ Product Details

EP20K200EF484C3NGZ Overview


There are two packages that contain fpga chips: 484-BBGA package and X package. A total of 376 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 8320 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. There are many types of FPGAs in the APEX-20KE? series, this is one of them. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Having a RAM bit size of 106496 means that this device will offer you a lot of memory. A total of 832 LABs/CLBs are included in this FPGA. As a basic building block, fpga semiconductor consists of 526000 gates. Its supplier package is called 484-FBGA (23x23).

EP20K200EF484C3NGZ Features


376 I/Os
Up to 106496 RAM bits

EP20K200EF484C3NGZ Applications


There are a lot of Intel EP20K200EF484C3NGZ FPGAs applications.

  • Industrial Ethernet
  • Wireless Communications
  • Medical imaging
  • Distributed Monetary Systems
  • Device controllers
  • Development Boards and Shields for Microcontrollers
  • DO-254
  • Data Center
  • Medical Electronics
  • Video & Image Processing

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