Welcome to Hotenda.com Online Store!

logo
userjoin
Home

EP20K200CB356C8ES

EP20K200CB356C8ES

EP20K200CB356C8ES

Intel

FPGAs APEX-20KC? Series 356-LBGA

SOT-23

EP20K200CB356C8ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20KC®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 271
Number of Logic Elements/Cells 8320
Total RAM Bits 106496
Number of Gates526000
Number of LABs/CLBs 832
In-Stock:2635 items

EP20K200CB356C8ES Product Details

EP20K200CB356C8ES Overview


In the package 356-LBGA, this product is provided. Its 271 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 8320 logic elements/cells are required. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 1.71V~1.89V . It is a type of FPGA that belongs to the APEX-20KC? series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. The RAM bits that this device offer is 106496. Fpga electronics contains 832 LABs/CLBs in an array. As a basic building block, fpga semiconductor consists of 526000 gates. As a supplier, 356-BGA (35x35) is responsible for the package of its devices.

EP20K200CB356C8ES Features


271 I/Os
Up to 106496 RAM bits

EP20K200CB356C8ES Applications


There are a lot of Intel EP20K200CB356C8ES FPGAs applications.

  • Electronic Warfare
  • Integrating multiple SPLDs
  • Medical imaging
  • Artificial intelligence (AI)
  • Solar Energy
  • Video & Image Processing
  • Military DSP
  • Secure Communication
  • Consumer Electronics
  • Defense Applications

Get Subscriber

Enter Your Email Address, Get the Latest News