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EP20K100CB356C9

EP20K100CB356C9

EP20K100CB356C9

Intel

FPGAs APEX-20K? Series 356-LBGA

SOT-23

EP20K100CB356C9 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20K®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 252
Number of Logic Elements/Cells 4160
Total RAM Bits 53248
Number of Gates263000
Number of LABs/CLBs 416
In-Stock:2983 items

EP20K100CB356C9 Product Details

EP20K100CB356C9 Overview


Fpga chips is supplied in the 356-LBGA package. A total of 252 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 4160 logic elements or cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. As part of the APEX-20K? series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~85°C TJ when operating. As a result of space limitations, this FPGA model has been included in Tray. The RAM bits that are offered by this fpga chips are 53248. Fpga electronics contains 416 LABs/CLBs in an array. Among its basic building blocks, there are 263000 gates that are included in it. There is a device package provided by 356-BGA (35x35) as its supplier.

EP20K100CB356C9 Features


252 I/Os
Up to 53248 RAM bits

EP20K100CB356C9 Applications


There are a lot of Intel EP20K100CB356C9 FPGAs applications.

  • Telecommunication
  • Aircraft navigation
  • Image processing
  • Development Boards and Shields for Microcontrollers
  • Industrial IoT
  • High Performance Computing
  • Audio
  • Defense Applications
  • Random logic
  • Automotive Applications

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