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EP20K100CB356C8ES

EP20K100CB356C8ES

EP20K100CB356C8ES

Intel

FPGAs APEX-20K? Series 356-LBGA

SOT-23

EP20K100CB356C8ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX-20K®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 252
Number of Logic Elements/Cells 4160
Total RAM Bits 53248
Number of Gates263000
Number of LABs/CLBs 416
In-Stock:3902 items

EP20K100CB356C8ES Product Details

EP20K100CB356C8ES Overview


In the 356-LBGA package, you will find fpga chips. There are 252 I/Os for better data transfer. A fundamental building block is made up of 4160 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. This is a type of FPGA that is part of the APEX-20K? series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. As far as the RAM bits are concerned, this device offers you a total of 53248. A total of 416 LABs/CLBs make up this FPGA array. The basic building block of this system consists of 263000 gates. There is a device package provided by 356-BGA (35x35) as its supplier.

EP20K100CB356C8ES Features


252 I/Os
Up to 53248 RAM bits

EP20K100CB356C8ES Applications


There are a lot of Intel EP20K100CB356C8ES FPGAs applications.

  • Software-defined radios
  • High Performance Computing
  • Embedded Vision
  • Solar Energy
  • Random logic
  • Image processing
  • Automotive Applications
  • Voice recognition
  • Wireless Communications
  • Filtering and communication encoding

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