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EP1S25F672C8NGA

EP1S25F672C8NGA

EP1S25F672C8NGA

Intel

FPGAs Stratix? Series 672-BBGA

SOT-23

EP1S25F672C8NGA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Stratix®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 473
Number of Logic Elements/Cells 25660
Total RAM Bits 1944576
Number of LABs/CLBs 2566
In-Stock:3235 items

EP1S25F672C8NGA Product Details

EP1S25F672C8NGA Overview


In the 672-BBGA package, you will find fpga chips. Fpga chips is programmed wFpga chipsh 473 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . This is a type of FPGA that is part of the Stratix? series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1944576 bFpga chipss. 2566 LABs/CLBs are configured on this FPGA. The supplier of the device package is 672-FBGA (27x27).

EP1S25F672C8NGA Features


473 I/Os
Up to 1944576 RAM bits

EP1S25F672C8NGA Applications


There are a lot of Intel EP1S25F672C8NGA FPGAs applications.

  • Industrial IoT
  • Military Temperature
  • Aerospace and Defense
  • Server Applications
  • DO-254
  • Ecosystem
  • Camera time adjustments
  • Telecommunication
  • Distributed Monetary Systems
  • Aircraft navigation

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