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EP1K50QC208-3AA

EP1K50QC208-3AA

EP1K50QC208-3AA

Intel

FPGAs ACEX-1K? Series 208-BFQFP

SOT-23

EP1K50QC208-3AA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Operating Temperature0°C~70°C TA
PackagingTray
Series ACEX-1K®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 147
Number of Logic Elements/Cells 2880
Total RAM Bits 40960
Number of Gates199000
Number of LABs/CLBs 360
In-Stock:4525 items

EP1K50QC208-3AA Product Details

EP1K50QC208-3AA Overview


There are two packages that contain fpga chips: 208-BFQFP package and X package. Its 147 I/Os help it transfer data more efficiently. A fundamental building block is made up of 2880 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 2.375V~2.625V is needed in order for fpga chips to operate. The ACEX-1K? Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~70°C TA when operating. As a space-saving measure, this FPGA model is contained within Tray. The RAM bits that are offered by this fpga chips are 40960. This FPGA is built as an array of 360 LABs/CLBs. As a basic building block, fpga semiconductor consists of 199000 gates. Its supplier package is called 208-PQFP (28x28).

EP1K50QC208-3AA Features


147 I/Os
Up to 40960 RAM bits

EP1K50QC208-3AA Applications


There are a lot of Intel EP1K50QC208-3AA FPGAs applications.

  • Camera time adjustments
  • Cryptography
  • ADAS
  • Security systems
  • Consumer Electronics
  • Data Center
  • Automotive Applications
  • Integrating multiple SPLDs
  • Wired Communications
  • Image processing

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