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EP1K50FI256-2AA

EP1K50FI256-2AA

EP1K50FI256-2AA

Intel

FPGAs ACEX-1K? Series 256-BBGA

SOT-23

EP1K50FI256-2AA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-BBGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature-40°C~85°C TA
PackagingTray
Series ACEX-1K®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 186
Number of Logic Elements/Cells 2880
Total RAM Bits 40960
Number of Gates199000
Number of LABs/CLBs 360
In-Stock:3803 items

EP1K50FI256-2AA Product Details

EP1K50FI256-2AA Overview


There are two packages that contain fpga chips: 256-BBGA package and X package. Its 186 I/Os help it transfer data more efficiently. To form a fundamental building block, there are 2880 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. There are many types of FPGAs in the ACEX-1K? series, this is one of them. Operating temperatures should be maintained within the -40°C~85°C TA range at all times when the unit is in use. As a result of space limitations, this FPGA model has been included in Tray. The RAM bits that this device offer is 40960. The FPGA consists of 360 LABs/CLBs. The basic building block of this system consists of 199000 gates. This device package is supplied by 256-FBGA (17x17).

EP1K50FI256-2AA Features


186 I/Os
Up to 40960 RAM bits

EP1K50FI256-2AA Applications


There are a lot of Intel EP1K50FI256-2AA FPGAs applications.

  • Automotive
  • Radar and Sensors
  • Voice recognition
  • Solar Energy
  • Filtering and communication encoding
  • Aerospace and Defense
  • DO-254
  • Embedded Vision
  • ADAS
  • Medical Electronics

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