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EP1K50FC256-3AA

EP1K50FC256-3AA

EP1K50FC256-3AA

Intel

FPGAs ACEX-1K? Series 256-BBGA

SOT-23

EP1K50FC256-3AA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-BBGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature0°C~70°C TA
PackagingTray
Series ACEX-1K®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 186
Number of Logic Elements/Cells 2880
Total RAM Bits 40960
Number of Gates199000
Number of LABs/CLBs 360
In-Stock:4938 items

EP1K50FC256-3AA Product Details

EP1K50FC256-3AA Overview


In the 256-BBGA package, you will find fpga chips. Having 186 I/Os makes data transfers more coherent. A fundamental building block consists of 2880 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 2.375V~2.625V is needed in order for fpga chips to operate. It is a type of FPGA that belongs to the ACEX-1K? series of FPGAs. Operating temperatures should be maintained within the 0°C~70°C TA range at all times when the unit is in use. Using the Tray layout, this FPGA model can be contained in a very small amount of space. As far as the RAM bits are concerned, this device offers you a total of 40960. This FPGA is built as an array of 360 LABs/CLBs. The building block that forms the basis of the system contains 199000 gates. There is a device package provided by 256-FBGA (17x17) as its supplier.

EP1K50FC256-3AA Features


186 I/Os
Up to 40960 RAM bits

EP1K50FC256-3AA Applications


There are a lot of Intel EP1K50FC256-3AA FPGAs applications.

  • Image processing
  • Software-defined radios
  • Embedded Vision
  • Medical Electronics
  • Industrial Ethernet
  • Medical ultrasounds
  • Artificial intelligence (AI)
  • Industrial,Medical and Scientific Instruments
  • Data Mining
  • Data center hardware accelerators

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