EP1K30QC208-3 Overview
There are two packages that contain fpga chips: 208-BFQFP package and X package. Fpga chips consists of LOADABLE PLD elements. The device has 147 I/O ports for more coherent data transfer. In order to construct a fundamental building block, 1728 logic elements/cells are required. 2.5V volts power it. There is a Field Programmable Gate Arrays family component in this FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. As part of the ACEX-1K? series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~70°C TA while the machine is operating. The device has 147 outputs that are integrated into it. A model of this FPGA is contained in Tray for the purpose of saving space. As a whole, it has 208 terminations. As far as the RAM bits are concerned, this device offers you a total of 24576. In order to find related parts, you can use its base part number EP1K30. The FPGA is built as an array of 216 latches or CLBs. An external power supply of 2.52.5/3.3V is required to power the device. Its basic building block contains 119000 gates.
EP1K30QC208-3 Features
147 I/Os
Up to 24576 RAM bits
EP1K30QC208-3 Applications
There are a lot of Intel EP1K30QC208-3 FPGAs applications.
- Military Temperature
- Data center hardware accelerators
- ASIC prototyping
- Industrial,Medical and Scientific Instruments
- Automotive
- Security systems
- Industrial IoT
- Automotive Applications
- Industrial Ethernet
- Broadcast
