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BEP03SBG1

BEP03SBG1

BEP03SBG1

Bulgin

Enclosures, Boxes, & Cases Polycarbonate Size 3 B Base/G Top + Hole

SOT-23

BEP03SBG1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Base
Material Plastic, Polycarbonate
Body Material Polycarbonate
PackagingBulk
Published 2008
Series BE
Size / Dimension 3.157Lx5.472W 80.20mmx139.00mm
Feature Knockouts, PCB Supports
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Color Black, Gray
Depth 24.5mm
Design Cover Included
Container Type Box
Area (L x W) 17.3in2 (112cm2)
Height 2.087 53.00mm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Ratings IP67
In-Stock:1664 items

About BEP03SBG1

The BEP03SBG1 from Bulgin is a high-performance microcontroller designed for a wide range of embedded applications. This component features Enclosures, Boxes, & Cases Polycarbonate Size 3 B Base/G Top + Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BEP03SBG1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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