5SGXMA3E2H29C1N Overview
In the 780-BBGA, FCBGA package, you will find fpga chips. This device features 360 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 340000 logic elements/cells are required. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the Stratix? V GX series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. This device has 19456000 RAM bits, which is the number of RAM bits that this device offers. You can find related parts by using the part number 5SGXMA3, which is its base part number. 128300 LABs/CLBs are configured on this FPGA. Device package 780-HBGA (33x33) is provided by its supplier.
5SGXMA3E2H29C1N Features
360 I/Os
Up to 19456000 RAM bits
5SGXMA3E2H29C1N Applications
There are a lot of Intel 5SGXMA3E2H29C1N FPGAs applications.
- Aircraft navigation
- Military DSP
- Medical imaging
- Consumer Electronics
- Development Boards and Shields for Microcontrollers
- Broadcast
- Medical ultrasounds
- Solar Energy
- Automotive Applications
- Artificial intelligence (AI)
