5SGSMD3E3H29C3N Overview
There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 360 I/Os are available for transferring data more efficiently. Logic blocks consist of 236000 logic elements/cells. The supply voltage is 0.85V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 0.82V~0.88V . It is a type of FPGA that belongs to the Stratix? V GS series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. The device has 360 outputs that are integrated into it. This FPGA model is contained in Tray for space saving. In total, the terminations of this piece are 780. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 13312000 bFpga chipss. You can find related parts by using the part number 5SGSMD3, which is its base part number. The FPGA is built as an array of 89000 latches or CLBs. There is a 0.851.52.52.5/31.2/3V power supply that is required to operate it.
5SGSMD3E3H29C3N Features
360 I/Os
Up to 13312000 RAM bits
5SGSMD3E3H29C3N Applications
There are a lot of Intel 5SGSMD3E3H29C3N FPGAs applications.
- Medical imaging
- Development Boards and Shields for Microcontrollers
- Digital signal processing
- Data Center
- High Performance Computing
- Distributed Monetary Systems
- DO-254
- Bioinformatics
- Military Temperature
- Space Applications
