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2035552022

2035552022

2035552022

Molex

CP65 WTB HDR RA SMT 4 RED 2CKT

SOT-23

2035552022 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Contact MaterialCopper Alloy
Mounting Type Surface Mount, Right Angle
Contact Shape Rectangular
Insulation Material Polyamide (PA), Nylon
Operating Temperature-40°C~105°C
PackagingTape & Reel (TR)
Series CP-6.5 203555
Feature Board Guide, Solder Retention
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 2
Applications General Purpose, Industrial
Voltage - Rated 600VAC/DC
Fastening TypeLatch Holder
Contact Finish - Mating Tin
Contact Type Tab
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.602 15.29mm
Style Board to Cable/Wire
Number of Positions Loaded All
Insulation Color Red
Row Spacing - Mating 0.256 (6.50mm)
Shrouding Shrouded - 4 Wall
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:3815 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.862473$1.862473
10$1.757051$17.57051
100$1.657594$165.7594
500$1.563769$781.8845
1000$1.475254$1475.254

About 2035552022

The 2035552022 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features CP65 WTB HDR RA SMT 4 RED 2CKT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2035552022, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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