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2027180100

2027180100

2027180100

Molex

2027180100 datasheet pdf and Pluggable Connectors product details from Molex stock available on our website

SOT-23

2027180100 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Contact MaterialNOT SPECIFIED
Mounting Type Surface Mount, Right Angle
Shell Material GLASS FILLED POLYETHYLENE
PackagingCut Tape (CT)
Published 2018
Series 202718
Feature Board Guide
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type QSFP-DD (Double Density)
Number of Positions 76
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 76
Reach Compliance Code compliant
Contact Finish Gold
Contact Gender FEMALE
UL Flammability Code 94V-0
Empty Shell NO
Connector Style Receptacle
Contact Finish Thickness 30.0μin 0.76μm
RoHS StatusRoHS Compliant
In-Stock:576 items

Pricing & Ordering

QuantityUnit PriceExt. Price
180$11.40000$2052
360$10.50000$3780
540$9.90000$5346
900$9.42000$8478

About 2027180100

The 2027180100 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2027180100 datasheet pdf and Pluggable Connectors product details from Molex stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2027180100, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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