1ST165EU3F50I3XG Overview
There are two packages that contain fpga chips: 2397-BBGA, FCBGA package and X package. 440 I/Os are available for transferring data more efficiently. There are 1650000 logic elements/cells to form a fundamental building block. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 0.82V~0.88V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Stratix? 10 TX seies. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Fpga electronics contains 206250 LABs/CLBs in an array.
1ST165EU3F50I3XG Features
440 I/Os
1ST165EU3F50I3XG Applications
There are a lot of Intel 1ST165EU3F50I3XG FPGAs applications.
- Automotive advanced driver assistance systems (ADAS)
- Cryptography
- Random logic
- Video & Image Processing
- Space Applications
- Device controllers
- Ecosystem
- Development Boards and Shields for Microcontrollers
- Digital signal processing
- Medical Applications
