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1SG280LU3F50I3XPAS

1SG280LU3F50I3XPAS

1SG280LU3F50I3XPAS

Intel

FPGAs Stratix? 10 GX Series 2397-BBGA, FCBGA

SOT-23

1SG280LU3F50I3XPAS Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 2397-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.82V~0.88V
Number of I/O 704
Number of Logic Elements/Cells 2800000
Number of LABs/CLBs 350000
In-Stock:2704 items

1SG280LU3F50I3XPAS Product Details

1SG280LU3F50I3XPAS Overview


Fpga chips is supplied in the 2397-BBGA, FCBGA package. Its 704 I/Os help it transfer data more efficiently. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.82V~0.88V and uses a battery to supply power. An FPGA belonging to the Stratix? 10 GX series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. 350000 LABs/CLBs are integrated into this FPGA.

1SG280LU3F50I3XPAS Features


704 I/Os

1SG280LU3F50I3XPAS Applications


There are a lot of Intel 1SG280LU3F50I3XPAS FPGAs applications.

  • Defense Applications
  • Wired Communications
  • Software-defined radio
  • Industrial IoT
  • Image processing
  • Scientific Instruments
  • Embedded Vision
  • High Performance Computing
  • Artificial intelligence (AI)
  • Solar Energy

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