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1SG280HU3F50E2VGAS

1SG280HU3F50E2VGAS

1SG280HU3F50E2VGAS

Intel

FPGAs Stratix? 10 GX Series 2397-BBGA, FCBGA

SOT-23

1SG280HU3F50E2VGAS Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 2397-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.77V~0.97V
Number of I/O 704
Number of Logic Elements/Cells 2800000
Number of LABs/CLBs 350000
In-Stock:3781 items

1SG280HU3F50E2VGAS Product Details

1SG280HU3F50E2VGAS Overview


There are two packages that contain fpga chips: 2397-BBGA, FCBGA package and X package. Having 704 I/Os makes data transfers more coherent. A fundamental building block consists of 2800000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates at a voltage of 0.77V~0.97V and uses a battery to supply power. The FPGA belongs to the Stratix? 10 GX series of FPGAs, and it is one type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. The FPGA is built as an array of 350000 latches or CLBs.

1SG280HU3F50E2VGAS Features


704 I/Os

1SG280HU3F50E2VGAS Applications


There are a lot of Intel 1SG280HU3F50E2VGAS FPGAs applications.

  • High Performance Computing
  • Medical Applications
  • Artificial intelligence (AI)
  • Data center hardware accelerators
  • Industrial,Medical and Scientific Instruments
  • Military Temperature
  • Embedded Vision
  • Automotive
  • Telecommunication
  • Camera time adjustments

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