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1SG166HN3F43E3XG

1SG166HN3F43E3XG

1SG166HN3F43E3XG

Intel

FPGAs Stratix? 10 GX Series 1760-BBGA, FCBGA

SOT-23

1SG166HN3F43E3XG Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.82V~0.88V
Number of I/O 688
Number of Logic Elements/Cells 1660000
Number of LABs/CLBs 207500
In-Stock:4702 items

1SG166HN3F43E3XG Product Details

1SG166HN3F43E3XG Overview


There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. Its 688 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 1660000 logic elements/cells are required. An FPGA module can be attached to a development board with a Surface Mount-pin. In order for it to operate, the supply voltage must be 0.82V~0.88V . There are many types of FPGAs in the Stratix? 10 GX series, this is one of them. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. A total of 207500 LABs/CLBs make up this FPGA array.

1SG166HN3F43E3XG Features


688 I/Os

1SG166HN3F43E3XG Applications


There are a lot of Intel 1SG166HN3F43E3XG FPGAs applications.

  • Data center search engines
  • Data Center
  • Enterprise networking
  • Embedded Vision
  • Cryptography
  • Distributed Monetary Systems
  • Bioinformatics
  • OpenCL
  • Computer hardware emulation
  • Artificial intelligence (AI)

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