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1SG166HN3F43E2VG

1SG166HN3F43E2VG

1SG166HN3F43E2VG

Intel

FPGAs Stratix? 10 GX Series 1760-BBGA, FCBGA

SOT-23

1SG166HN3F43E2VG Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.77V~0.97V
Number of I/O 688
Number of Logic Elements/Cells 1660000
Number of LABs/CLBs 207500
In-Stock:1623 items

1SG166HN3F43E2VG Product Details

1SG166HN3F43E2VG Overview


There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. The device has 688 I/O ports for more coherent data transfer. Logic blocks consist of 1660000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 0.77V~0.97V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the Stratix? 10 GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. An array of 207500 LABs/CLBs is built into the FPGA.

1SG166HN3F43E2VG Features


688 I/Os

1SG166HN3F43E2VG Applications


There are a lot of Intel 1SG166HN3F43E2VG FPGAs applications.

  • OpenCL
  • Random logic
  • Digital signal processing
  • Defense Applications
  • Medical Applications
  • Data Center
  • Wired Communications
  • Wireless Communications
  • Bioinformatics
  • Data center search engines

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