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1SG166HN3F43E2LG

1SG166HN3F43E2LG

1SG166HN3F43E2LG

Intel

FPGAs Stratix? 10 GX Series 1760-BBGA, FCBGA

SOT-23

1SG166HN3F43E2LG Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.82V~0.88V
Number of I/O 688
Number of Logic Elements/Cells 1660000
Number of LABs/CLBs 207500
In-Stock:3834 items

1SG166HN3F43E2LG Product Details

1SG166HN3F43E2LG Overview


There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. Having 688 I/Os makes data transfers more coherent. A fundamental building block consists of 1660000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.82V~0.88V, this device operates with ease. It is a type of FPGA that belongs to the Stratix? 10 GX series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~100°C TJ when operating. The FPGA consists of 207500 LABs/CLBs.

1SG166HN3F43E2LG Features


688 I/Os

1SG166HN3F43E2LG Applications


There are a lot of Intel 1SG166HN3F43E2LG FPGAs applications.

  • Software-defined radio
  • Video & Image Processing
  • Medical imaging
  • Data Center
  • Telecommunication
  • Random logic
  • Automotive
  • Image processing
  • Wired Communications
  • Industrial Ethernet

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