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1731130173

1731130173

1731130173

Molex

PCB ANGLED HIGH DENSITSY D-SUB

SOT-23

1731130173 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Contact MaterialCopper Alloy
Mounting Type Through Hole, Right Angle
Dielectric MaterialThermoplastic, Glass Filled
Shell Material, Finish Steel, Nickel Plated
Operating Temperature-55°C~105°C
PackagingBulk
Series CT, FCT
Feature Board Lock, Grounding Indents, Mounting Brackets
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Plug, Male Pins
Number of Positions 26
Color Black
Number of Rows 3
Contact Type Signal
Current Rating (Amps) 3A
Ingress ProtectionIP20
Contact Finish Gold
Flange Feature Housing/Shell (4-40)
Connector Style D-Sub, High Density
Shell Size, Connector Layout2 DA A High Density
Backset Spacing 0.450 (11.43mm)
Contact Finish Thickness Flash
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:420 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$15.722000$15.722
10$14.832075$148.32075
100$13.992524$1399.2524
500$13.200494$6600.247
1000$12.453297$12453.297

About 1731130173

The 1731130173 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features PCB ANGLED HIGH DENSITSY D-SUB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1731130173, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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