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1731130001

1731130001

1731130001

Molex

PCB ANGLED HIGH DENSITSY D-SUB

SOT-23

1731130001 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Contact MaterialCopper Alloy
Mounting Type Through Hole, Right Angle
Dielectric MaterialThermoplastic, Glass Filled
Shell Material, Finish Steel, Nickel Plated
Operating Temperature-55°C~105°C
PackagingBulk
Series CT, FCT
Feature Board Lock, Mounting Brackets
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 44
Color Black
Number of Rows 3
Contact Type Signal
Current Rating (Amps) 3A
Ingress ProtectionIP20
Contact Finish Gold
Flange Feature Housing/Shell (4-40)
Connector Style D-Sub, High Density
Shell Size, Connector Layout3 DB B High Density
Backset Spacing 0.450 (11.43mm)
Contact Finish Thickness Flash
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:610 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.98000$12.98
500$12.8502$6425.1
1000$12.7204$12720.4
1500$12.5906$18885.9
2000$12.4608$24921.6
2500$12.331$30827.5

About 1731130001

The 1731130001 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features PCB ANGLED HIGH DENSITSY D-SUB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1731130001, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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