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1731100014

1731100014

1731100014

Molex

CONN D-SUB PLUG 25P SLDR CUP

SOT-23

1731100014 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact MaterialBrass
Mounting Type Free Hanging (In-Line)
Dielectric MaterialPolybutylene Terephthalate (PBT)
Shell Material, Finish Brass, Tin Plated
Operating Temperature-25°C~70°C
PackagingBulk
Published 2014
Series F, FCT
Feature Grounding Indents
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder Cup
Connector Type Plug, Male Pins
Number of Positions 25
Color Red
Number of Rows 2
Contact Type Signal
Current Rating (Amps) 5A
Ingress ProtectionIP67 - Dust Tight, Waterproof
Contact Finish Gold
Wire Gauge20 AWG
Flange Feature Housing/Shell (Unthreaded)
Connector Style D-Sub
Contact FormMachined
Shell Size, Connector Layout3 DB B
Contact Finish Thickness 31.5μin 0.80μm
Material Flammability Rating UL94 V-0
RoHS StatusNon-RoHS Compliant
In-Stock:411 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$20.92000$20.92
10$19.42400$194.24
25$17.43160$435.79
50$16.93340$846.67
100$14.94120$1494.12
250$13.94512$3486.28
500$13.64630$6823.15

About 1731100014

The 1731100014 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN D-SUB PLUG 25P SLDR CUP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1731100014, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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