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10M50DAF672C6GES

10M50DAF672C6GES

10M50DAF672C6GES

Intel

FPGAs MAX? 10 Series 672-BGA

SOT-23

10M50DAF672C6GES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 672-BGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature0°C~85°C TJ
PackagingTray
Series MAX® 10
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.15V~1.25V
Number of I/O 500
Number of Logic Elements/Cells 50000
Total RAM Bits 1677312
Number of LABs/CLBs 3125
RoHS StatusRoHS Compliant
In-Stock:3597 items

Pricing & Ordering

QuantityUnit PriceExt. Price
5$193.92000$969.6

10M50DAF672C6GES Product Details

10M50DAF672C6GES Overview


There is a 672-BGA package that includes this component. A total of 500 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 50000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. With a supply voltage of 1.15V~1.25V, this device operates with ease. As part of the MAX? 10 series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. This device has 1677312 RAM bits, which is the number of RAM bits that this device offers. 3125 LABs/CLBs are integrated into this FPGA. 672-FBGA (27x27) stands for its supplier device package.

10M50DAF672C6GES Features


500 I/Os
Up to 1677312 RAM bits

10M50DAF672C6GES Applications


There are a lot of Intel 10M50DAF672C6GES FPGAs applications.

  • Military Temperature
  • Solar Energy
  • Filtering and communication encoding
  • Aerospace and Defense
  • Software-defined radios
  • Medical ultrasounds
  • Security systems
  • Medical Electronics
  • Telecommunication
  • Consumer Electronics

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