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10M25DCF256I6G

10M25DCF256I6G

10M25DCF256I6G

Intel

FPGAs MAX? 10 Series 256-LBGA 256

SOT-23

10M25DCF256I6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-LBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series MAX® 10
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of I/O 178
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 25000
Total RAM Bits 691200
Number of LABs/CLBs 1563
RoHS StatusRoHS Compliant
In-Stock:3442 items

10M25DCF256I6G Product Details

10M25DCF256I6G Overview


In the 256-LBGA package, you will find fpga chips. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 178 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 25000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 1.15V~1.25V . There are many types of FPGAs in the MAX? 10 series, this is one of them. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. In total, the terminations of this piece are 256. As far as the RAM bits are concerned, this device offers you a total of 691200. 1563 LABs/CLBs are configured on this FPGA.

10M25DCF256I6G Features


178 I/Os
Up to 691200 RAM bits

10M25DCF256I6G Applications


There are a lot of Intel 10M25DCF256I6G FPGAs applications.

  • ADAS
  • Security systems
  • Distributed Monetary Systems
  • Random logic
  • Industrial Ethernet
  • Wireless Communications
  • Aerospace and Defense
  • Data center hardware accelerators
  • Software-defined radios
  • Image processing

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