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10M25DAF484I6G

10M25DAF484I6G

10M25DAF484I6G

Intel

FPGAs MAX? 10 Series 484-BGA 484

SOT-23

10M25DAF484I6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series MAX® 10
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 360
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 25000
Total RAM Bits 691200
Number of LABs/CLBs 1563
RoHS StatusRoHS Compliant
In-Stock:3414 items

10M25DAF484I6G Product Details

10M25DAF484I6G Overview


In the package 484-BGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 360 I/Os help it transfer data more efficiently. The basic building blocks of logic contain 25000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 1.15V~1.25V supply voltage, fpga chips is able to operate at high speeds. The MAX? 10 series FPGA is a type of FPGA that belongs to the MAX? 10 family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 484 terminations. This device has 691200 RAM bits, which is the number of RAM bits that this device offers. 1563 LABs/CLBs are integrated into this FPGA.

10M25DAF484I6G Features


360 I/Os
Up to 691200 RAM bits

10M25DAF484I6G Applications


There are a lot of Intel 10M25DAF484I6G FPGAs applications.

  • Medical imaging
  • Medical ultrasounds
  • Enterprise networking
  • High Performance Computing
  • Data center hardware accelerators
  • Digital signal processing
  • Distributed Monetary Systems
  • Industrial Ethernet
  • Secure Communication
  • Aerospace and Defense

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