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10M08SAU169C8G

10M08SAU169C8G

10M08SAU169C8G

Intel

FPGAs MAX® 10 Series 169-LFBGA 169

SOT-23

10M08SAU169C8G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 169-LFBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series MAX® 10
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 169
HTS Code8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B169
Number of I/O 130
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of LABs/CLBs 500
RoHS StatusRoHS Compliant
In-Stock:4704 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$15.48000$15.48
25$12.38000$309.5
100$12.07000$1207
500$11.61004$5805.02

10M08SAU169C8G Product Details

10M08SAU169C8G Overview


A 169-LFBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 130 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 8000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 2.85V~3.465V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the MAX® 10 series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 169 terminations. The RAM bits that are offered by this fpga chips are 387072. Fpga electronics contains 500 LABs/CLBs in an array.

10M08SAU169C8G Features


130 I/Os
Up to 387072 RAM bits


10M08SAU169C8G Applications


There are a lot of Intel
10M08SAU169C8G FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive

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