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10AX115U2F45I1SG

10AX115U2F45I1SG

10AX115U2F45I1SG

Intel

3.65mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX115U2F45I1SG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Terminal Pitch1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 480
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.65mm
Length 45mm
Width 45mm
RoHS StatusRoHS Compliant
In-Stock:2961 items

Pricing & Ordering

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10AX115U2F45I1SG Product Details

10AX115U2F45I1SG Overview


A 1932-BBGA, FCBGA package is provided with this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Fpga chips is programmed wFpga chipsh 480 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 0.9V. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 0.87V~0.98V battery. FPGAs belonging to the Arria 10 GX series are a type of FPGA that belong to the Arria 10 GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that this device offer is 68857856. An array of 427200 LABs/CLBs is built into the FPGA.

10AX115U2F45I1SG Features


480 I/Os
Up to 68857856 RAM bits

10AX115U2F45I1SG Applications


There are a lot of Intel 10AX115U2F45I1SG FPGAs applications.

  • Aerospace and Defense
  • Artificial intelligence (AI)
  • Automotive advanced driver assistance systems (ADAS)
  • Military DSP
  • Defense Applications
  • Medical ultrasounds
  • Audio
  • Data center hardware accelerators
  • Bioinformatics
  • Data Mining

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