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10AX115U1F45I2SGES

10AX115U1F45I2SGES

10AX115U1F45I2SGES

Intel

FPGAs Arria 10 GX Series 1932-BBGA, FCBGA

SOT-23

10AX115U1F45I2SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 480
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
In-Stock:4888 items

10AX115U1F45I2SGES Product Details

10AX115U1F45I2SGES Overview


This package is included in the 1932-BBGA, FCBGA package and is available for purchase. This device features 480 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 1150000 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.87V~0.93V. This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that are offered by this fpga chips are 68857856. The FPGA consists of 427200 LABs/CLBs. There is a device package provided by 1932-FBGA, FC (45x45), which is the supplier.

10AX115U1F45I2SGES Features


480 I/Os
Up to 68857856 RAM bits

10AX115U1F45I2SGES Applications


There are a lot of Intel 10AX115U1F45I2SGES FPGAs applications.

  • Automation
  • Scientific Instruments
  • Solar Energy
  • Automotive
  • Software-defined radios
  • Bioinformatics
  • Industrial,Medical and Scientific Instruments
  • Data center hardware accelerators
  • Broadcast
  • Automotive Applications

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