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10AX115S3F45I3SGES

10AX115S3F45I3SGES

10AX115S3F45I3SGES

Intel

FPGAs Arria 10 GX Series 1932-BBGA, FCBGA

SOT-23

10AX115S3F45I3SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 624
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
In-Stock:4346 items

10AX115S3F45I3SGES Product Details

10AX115S3F45I3SGES Overview


This package is included in the 1932-BBGA, FCBGA package and is available for purchase. Having 624 I/Os makes data transfers more coherent. A fundamental building block consists of 1150000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 0.87V~0.93V . The FPGA belongs to the Arria 10 GX series of FPGAs, and it is one type of FPGA. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. This FPGA model is contained in Tray for space saving. This device has 68857856 RAM bits, which is the number of RAM bits that this device offers. 427200 LABs/CLBs are integrated into this FPGA. As a supplier, 1932-FBGA, FC (45x45) is responsible for the package of its devices.

10AX115S3F45I3SGES Features


624 I/Os
Up to 68857856 RAM bits

10AX115S3F45I3SGES Applications


There are a lot of Intel 10AX115S3F45I3SGES FPGAs applications.

  • Aircraft navigation
  • Solar Energy
  • Automation
  • Secure Communication
  • Industrial Ethernet
  • Distributed Monetary Systems
  • Embedded Vision
  • OpenCL
  • Military Temperature
  • Aerospace and Defense

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