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10AX115S1F45I2SGES

10AX115S1F45I2SGES

10AX115S1F45I2SGES

Intel

FPGAs Arria 10 GX Series 1932-BBGA, FCBGA

SOT-23

10AX115S1F45I2SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 624
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
In-Stock:1766 items

10AX115S1F45I2SGES Product Details

10AX115S1F45I2SGES Overview


As part of the 1932-BBGA, FCBGA package, it is included. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 1150000 logic elements or cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. It is a type of FPGA belonging to the Arria 10 GX seies. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 68857856 bFpga chipss. This FPGA is built as an array of 427200 LABs/CLBs. There is a device package provided by 1932-FBGA, FC (45x45) as its supplier.

10AX115S1F45I2SGES Features


624 I/Os
Up to 68857856 RAM bits

10AX115S1F45I2SGES Applications


There are a lot of Intel 10AX115S1F45I2SGES FPGAs applications.

  • Data center search engines
  • Automotive
  • High Performance Computing
  • Image processing
  • ASIC prototyping
  • Medical Applications
  • Computer hardware emulation
  • Artificial intelligence (AI)
  • Automation
  • Scientific Instruments

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