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10AX115N1F40I2SGES

10AX115N1F40I2SGES

10AX115N1F40I2SGES

Intel

FPGAs Arria 10 GX Series 1517-BBGA, FCBGA

SOT-23

10AX115N1F40I2SGES Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 600
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
In-Stock:1305 items

10AX115N1F40I2SGES Product Details

10AX115N1F40I2SGES Overview


There are two packages that contain fpga chips: 1517-BBGA, FCBGA package and X package. This device features 600 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 1150000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. The supply voltage of the device is 0.87V~0.93V , at which it runs. This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. The operating temperature should be kept at -40°C~100°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. As far as the RAM bits are concerned, this device offers you a total of 68857856. A total of 427200 LABs/CLBs are included in this FPGA. Its supplier package is called 1517-FCBGA (40x40).

10AX115N1F40I2SGES Features


600 I/Os
Up to 68857856 RAM bits

10AX115N1F40I2SGES Applications


There are a lot of Intel 10AX115N1F40I2SGES FPGAs applications.

  • DO-254
  • Distributed Monetary Systems
  • Bioinformatics
  • ADAS
  • Enterprise networking
  • Automation
  • Industrial IoT
  • Military DSP
  • Telecommunication
  • Device controllers

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