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10AX066K3F35I2SGES

10AX066K3F35I2SGES

10AX066K3F35I2SGES

Intel

3.5mm mm FPGAs Arria 10 GX Series 1152-BBGA, FCBGA 1mm mm

SOT-23

10AX066K3F35I2SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Terminal Pitch1mm
JESD-30 Code S-PBGA-B1152
Number of I/O 396
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 660000
Total RAM Bits 49610752
Number of LABs/CLBs 250540
Height Seated (Max) 3.5mm
Length 35mm
Width 35mm
RoHS StatusRoHS Compliant
In-Stock:2580 items

Pricing & Ordering

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10AX066K3F35I2SGES Product Details

10AX066K3F35I2SGES Overview


A 1152-BBGA, FCBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 660000 logic elements/cells. Fpga chips is powered from a supply voltage of 0.9V. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. It is a type of FPGA belonging to the Arria 10 GX seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In order to save space, this FPGA model has been contained in Tray. The RAM bits that this device offer is 49610752. The FPGA consists of 250540 LABs/CLBs.

10AX066K3F35I2SGES Features


396 I/Os
Up to 49610752 RAM bits

10AX066K3F35I2SGES Applications


There are a lot of Intel 10AX066K3F35I2SGES FPGAs applications.

  • Radar and Sensors
  • Artificial intelligence (AI)
  • Digital signal processing
  • Broadcast
  • Automotive driver's assistance
  • Data Center
  • Industrial IoT
  • Automation
  • Medical ultrasounds
  • Wireless Communications

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