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10AX066H1F34I1SG

10AX066H1F34I1SG

10AX066H1F34I1SG

Intel

3.65mm mm FPGAs Arria 10 GX Series 1152-BBGA, FCBGA 1mm mm

SOT-23

10AX066H1F34I1SG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Terminal Pitch1mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B1152
Number of I/O 492
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 660000
Total RAM Bits 49610752
Number of LABs/CLBs 250540
Height Seated (Max) 3.65mm
Length 35mm
Width 35mm
RoHS StatusRoHS Compliant
In-Stock:4904 items

Pricing & Ordering

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10AX066H1F34I1SG Product Details

10AX066H1F34I1SG Overview


In the 1152-BBGA, FCBGA package, you will find fpga chips. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. A total of 492 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 660000 logic elements/cells. It is powered from a supply voltage of 0.9V. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 0.87V~0.98V . The Arria 10 GX Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that are offered by this fpga chips are 49610752. An array of 250540 LABs/CLBs is built into the FPGA.

10AX066H1F34I1SG Features


492 I/Os
Up to 49610752 RAM bits

10AX066H1F34I1SG Applications


There are a lot of Intel 10AX066H1F34I1SG FPGAs applications.

  • Scientific Instruments
  • Artificial intelligence (AI)
  • Radar and Sensors
  • Medical imaging
  • Consumer Electronics
  • Industrial,Medical and Scientific Instruments
  • Data center search engines
  • Integrating multiple SPLDs
  • Enterprise networking
  • Wired Communications

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