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10AX032H2F35E1HG

10AX032H2F35E1HG

10AX032H2F35E1HG

Intel

FPGAs Arria 10 GX Series 1152-BBGA, FCBGA

SOT-23

10AX032H2F35E1HG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.98V
Number of I/O 384
Number of Logic Elements/Cells 320000
Total RAM Bits 21040128
Number of LABs/CLBs 119900
RoHS StatusRoHS Compliant
In-Stock:2510 items

Pricing & Ordering

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10AX032H2F35E1HG Product Details

10AX032H2F35E1HG Overview


There are two packages that contain fpga chips: 1152-BBGA, FCBGA package and X package. Its 384 I/Os help it transfer data more efficiently. The basic building blocks of logic contain 320000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 0.87V~0.98V is needed in order for fpga chips to operate. FPGAs belonging to the Arria 10 GX series are a type of FPGA that belong to the Arria 10 GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. As a result of space limitations, this FPGA model has been included in Tray. A device like this one offers 21040128 RAM bits, which is a considerable amount of memory. An array of 119900 LABs/CLBs is built into the FPGA.

10AX032H2F35E1HG Features


384 I/Os
Up to 21040128 RAM bits

10AX032H2F35E1HG Applications


There are a lot of Intel 10AX032H2F35E1HG FPGAs applications.

  • Integrating multiple SPLDs
  • Data center hardware accelerators
  • Distributed Monetary Systems
  • Audio
  • Random logic
  • Voice recognition
  • Security systems
  • Aerospace and Defense
  • Medical Applications
  • Software-defined radios

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