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0912283005

0912283005

0912283005

Molex

Conn Chip SIM RCP 6 POS 2.54mm Solder ST SMD 0.5A/Contact Embossed T/R

SOT-23

0912283005 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Contact MaterialBronze
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Mounting FeatureNormal, Standard - Top
Housing Material Polymer
PackagingTape & Reel (TR)
Series 91228
Feature Switch
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Connector and Ejector
Number of Positions 8 (6 + 2)
Max Operating Temperature85°C
Min Operating Temperature -30°C
Number of Rows 2
Pitch 2.54mm
Orientation Straight
Depth 38.6mm
Reach Compliance Code unknown
Current Rating500mA
Contact Finish Gold
Card Type SIM Card
Number of Circuits 6
Max Voltage Rating (DC) 50V
Insertion, Removal Method Push In, Push Out
Ejector Side Left
Length 25mm
Contact Finish Thickness 10.0μin 0.25μm
Height Above Board 0.118 3.00mm
RoHS StatusROHS3 Compliant
In-Stock:2280 items

Pricing & Ordering

QuantityUnit PriceExt. Price
800$5.88439$4707.512

About 0912283005

The 0912283005 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Chip SIM RCP 6 POS 2.54mm Solder ST SMD 0.5A/Contact Embossed T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0912283005, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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