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0876232111

0876232111

0876232111

Molex

DIMM Connectors 1.27mm 25Deg DDR DIM DIMM .76AuLF 184Ckt

SOT-23

0876232111 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Mount Through Hole
Mounting Type Through Hole, 25° Angle
Mounting FeatureNormal, Standard - Top
Insulation Material Thermoplastic
PackagingTray
Series 87623
JESD-609 Code e3
Feature Board Guide, Board Lock, Latches
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Max Operating Temperature85°C
Min Operating Temperature -40°C
Number of Rows 2
Additional FeatureLOW PROFILE, POLARIZED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 1.27mm
Orientation Straight
Depth 30.67mm
Current Rating1A
Contact Finish Gold
Voltage - Rated AC 50V
Number of Contacts 184
Contact Gender FEMALE
Contact Resistance 40mOhm
Insulation Resistance1GOhm
Body/Shell Style SOCKET
Connector Style DIMM
Memory TypeDDR SDRAM
Standards MO-206
Length 148.5mm
Contact Finish Thickness 30.0μin 0.76μm
RoHS StatusROHS3 Compliant
In-Stock:1904 items

About 0876232111

The 0876232111 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIMM Connectors 1.27mm 25Deg DDR DIM DIMM .76AuLF 184Ckt.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0876232111, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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