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0876090051

0876090051

0876090051

Molex

Conn DDR DIMM Socket SKT 168 POS 2.54mm Solder RA Thru-Hole Tray

SOT-23

0876090051 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Mounting FeatureNormal, Standard - Top
Insulation Material Polymer
PackagingTray
Series 87609
JESD-609 Code e3
Feature Board Guide, Board Lock, Latches
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 168
Max Operating Temperature85°C
Min Operating Temperature -10°C
Number of Rows 4
Additional FeatureLATCHED, POLARIZED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 2.54mm
Total Number of Contacts 168
Orientation Right Angle
Depth 28.85mm
Contact Finish Gold
Voltage - Rated AC 125V
Contact Gender FEMALE
Body/Shell Style SOCKET
Number of Circuits 26
Connector Style DIMM
Memory TypeDDR SDRAM
Standards MO-161
Length 148.5mm
Contact Finish Thickness 15.0μin 0.38μm
RoHS StatusROHS3 Compliant
In-Stock:4136 items

About 0876090051

The 0876090051 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn DDR DIMM Socket SKT 168 POS 2.54mm Solder RA Thru-Hole Tray.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0876090051, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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