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0857931003

0857931003

0857931003

Molex

Conn Modular Jack F 8 POS Solder RA Thru-Hole 20 Terminal 1 Port Tray Cat 5e

SOT-23

0857931003 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 21 Weeks
Contact MaterialCopper Alloy
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT)
Shield Material Stainless Steel
Operating Temperature0°C~70°C
PackagingTray
Series 85793
JESD-609 Code e3
Feature Board Lock
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type RJ45
Applications 10/100/1000 Base-T, AutoMDIX
Orientation 90° Angle (Right)
Shielding Shielded, EMI Finger
Contact Finish Gold
Number of Ports1
LED ColorGreen, Orange - Green
Tab Direction Up
Number of Cores per Jack 8
Contact Finish Thickness 30.0μin 0.76μm
Height Above Board 0.546 13.87mm
RoHS StatusROHS3 Compliant
In-Stock:491 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.94000$12.94
10$11.86200$118.62
25$11.59280$289.82
50$10.78420$539.21
100$10.24500$1024.5
396$9.43616$3736.71936
792$8.46559$6704.74728

About 0857931003

The 0857931003 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Modular Jack F 8 POS Solder RA Thru-Hole 20 Terminal 1 Port Tray Cat 5e.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0857931003, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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