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0713085492

0713085492

0713085492

Molex

CONN HEADER BKWY SMD TIN 92POS

SOT-23

0713085492 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact MaterialCopper Alloy
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
PackagingTube
Series C-Grid 71308
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 92
Applications Automotive, General Purpose, Lighting, Medical, Telecommunications
Number of Rows 2
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Insulation Height 0.090 2.29mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.240 6.10mm
Contact Finish Thickness - Mating 59.0μin 1.50μm
Contact Finish Thickness - Post 59.0μin 1.50μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:2536 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 0713085492

The 0713085492 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER BKWY SMD TIN 92POS.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0713085492, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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