Name: 0436501126
Brand: Molex
SKU: 0436501126
Price: 2.26000 USD
Availability: InStock

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0436501126

Manufacturer part number:0436501126

Manufacturer:Molex

Description:0436501126 datasheet pdf and Rectangular Connectors - Headers, Male Pins product details from Molex stock available on our website

Case Package:SOT-23

Datasheet:0436501126 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	9 Weeks
Contact Material	Brass
Mounting Type	Surface Mount
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP), Glass Filled
Shell Material	POLYETHYLENE
Packaging	Tape & Reel (TR)
Series	Micro-Fit 3.0 43650
JESD-609 Code	e3
Feature	Solder Retention
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Connector Type	Header
Number of Positions	11
Applications	General Purpose, Medical, Military, Telecommunications
Number of Rows	1
Additional Feature	MICRO-FIT 3.0, POLARIZED, SHROUDED
HTS Code	8536.69.40.30
Fastening Type	Locking Ramp
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Total Number of Contacts	11
Insulation Height	0.390 9.91mm
Style	Board to Cable/Wire
Number of Positions Loaded	All
Pitch - Mating	0.118 3.00mm
Insulation Color	Black
Shrouding	Shrouded - 4 Wall
Contact Finish - Post	Tin
UL Flammability Code	94V-0
Empty Shell	NO
Contact Finish Thickness - Mating	30.0μin 0.76μm
Contact Finish Thickness - Post	100.0μin 2.54μm
Stack Height (Mating)	17.56mm
Material Flammability Rating	UL94 V-0
RoHS Status	ROHS3 Compliant

0436501126 Product Details

0436501126 Overview

You'll get Header packages.This device's mounting type is Surface Mount.To package the product, we use a Tape & Reel (TR) case.This product is part of the Micro-Fit 3.0 43650 Series.Furthermore, there are other features available, such as MICRO-FIT 3.0, POLARIZED, SHROUDED, to name a few.There's an application for it called General Purpose, Medical, Military, Telecommunications.A number of benefits can be derived from the Solder Retention feature of this application.