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0190670104

0190670104

0190670104

Molex

0190670104 datasheet pdf and Terminals - Ring Connectors product details from Molex stock available on our website

SOT-23

0190670104 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Contact MaterialCopper
Mounting Type Free Hanging (In-Line)
Material - Insulation Polyamide (PA), Nylon
PackagingBulk
Series NylaKrimp
Feature Brazed Seam
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
Color Blue
HTS Code8536.90.40.00
Contact Finish Electro-Tin
Wire Gauge1/0 AWG
Terminal and Terminal Block Type RING TERMINAL
Insulation Diameter 0.680 (17.27mm)
Insulation Insulated
Terminal TypeFlat Sided
Stud/Tab Size 5/16 Stud
Thickness 0.075 1.91mm
Length - Overall 2.628 66.75mm
Width - Outer Edges 0.840 21.34mm
RoHS StatusROHS3 Compliant
In-Stock:2825 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.03000$3.03
10$2.91000$29.1
25$2.66760$66.69
50$2.54640$127.32
100$2.42520$242.52
250$2.12204$530.51
500$2.06142$1030.71

About 0190670104

The 0190670104 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features 0190670104 datasheet pdf and Terminals - Ring Connectors product details from Molex stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0190670104, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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