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0190110038

0190110038

0190110038

Molex

Quick Disconnect Terminal 14-16AWG F 22.1mm 6.35mm Tin InsulKrimp™ Adhesive T/R

SOT-23

0190110038 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBrass
Contact PlatingTin
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
PackagingCut Tape (CT)
Series InsulKrimp
Pbfree Code yes
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
Color Blue
Gender Female and Male
HTS Code8536.90.40.00
Orientation Straight
Depth 6.35mm
Wire Gauge14-16 AWG
Wire Gauge (Max) 16 AWG
Wire Gauge (Min) 14 AWG
Terminal and Terminal Block Type PUSH-ON TERMINAL
Insulation Diameter 0.140 (3.56mm)
Insulation Non-Mating End Insulated
Terminal TypeStacked
Length - Tab 0.310 7.87mm
Length 22.098mm
Length - Overall 0.870 22.10mm
Tab Thickness 0.032 0.81mm
Width - Tab 0.250 6.35mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:8849 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.694430$0.69443
10$0.655122$6.55122
100$0.618040$61.804
500$0.583056$291.528
1000$0.550054$550.054

About 0190110038

The 0190110038 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features Quick Disconnect Terminal 14-16AWG F 22.1mm 6.35mm Tin InsulKrimp™ Adhesive T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0190110038, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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