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0022288013

0022288013

0022288013

Molex

CONN HEADER R/A 1POS 2.54MM

SOT-23

0022288013 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Polyamide (PA), Nylon, Glass Filled
PackagingBulk
Series KK 42377
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 1
Applications Automotive, General Purpose, Medical, Telecommunications
Fastening TypePush-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Insulation Height 0.098 2.50mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.630 16.00mm
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.324 8.23mm
Contact Finish Thickness - Mating 15.0μin 0.38μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:57948 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.120000$0.12
10$0.113208$1.13208
100$0.106800$10.68
500$0.100754$50.377
1000$0.095051$95.051

About 0022288013

The 0022288013 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER R/A 1POS 2.54MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0022288013, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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