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0015311066

0015311066

0015311066

Molex

0015311066 datasheet pdf and Rectangular Connectors - Headers, Male Pins product details from Molex stock available on our website

SOT-23

0015311066 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polyamide (PA66), Nylon 6/6
PackagingBulk
Series 5219
JESD-609 Code e3
Feature Board Lock
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 6
Applications General Purpose, Telecommunications
Number of Rows 2
Fastening TypeLocking Ramp
Contact Finish - Mating Tin
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Insulation Height 0.591 15.00mm
Style Board to Cable/Wire
Number of Positions Loaded All
Pitch - Mating 0.264 6.71mm
Insulation Color Natural
Row Spacing - Mating 0.264 (6.71mm)
Contact Length - Post 0.138 3.50mm
Shrouding Shrouded - 4 Wall
Contact Gender FEMALE AND MALE
Empty Shell NO
Contact Finish Thickness - Mating 39.4μin 1.00μm
Contact Finish Thickness - Post 39.4μin 1.00μm
Material Flammability Rating UL94 V-2
RoHS StatusROHS3 Compliant
In-Stock:3051 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.708100$3.7081
10$3.498208$34.98208
100$3.300196$330.0196
500$3.113392$1556.696
1000$2.937163$2937.163

0015311066 Product Details

0015311066 Overview


Header packaging is included.The device's mounting type is Through Hole.It has been determined that a Bulk case is necessary to package the product.It's part of the 5219 Series.The device could be used for General Purpose, Telecommunications.A number of advantages are provided by its Board Lock feature.

0015311066 Features


5219 series

0015311066 Applications


There are a lot of Molex 0015311066 Rectangular Connectors applications.

  • Transportation
  • Communication
  • Military Technology
  • Industrial Automation
  • Telecommunications
  • Datacom
  • Medical technology
  • Embedded systems
  • Data Technology
  • Instrumentation

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