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TC1-200G

TC1-200G

TC1-200G

Chip Quik Inc.

HEAT SINK COMPOUND - HIGH DENSIT

SOT-23

TC1-200G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Size / Dimension 200 gram Jar
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Silicone Compound
Color White
Shelf Life 60 Months
Storage/Refrigeration Temperature 37°F~77°F 3°C~25°C
Shelf Life Start Date of Manufacture
Thermal Conductivity0.67W/m-K
RoHS StatusROHS3 Compliant
In-Stock:161 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$49.95000$49.95

About TC1-200G

The TC1-200G from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEAT SINK COMPOUND - HIGH DENSIT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TC1-200G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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