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PA0193

PA0193

PA0193

Chip Quik Inc.

TSSOP-16-EXP-PAD TO DIP-16 SMT

SOT-23

PA0193 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Package Accepted TSSOP
Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 0.800 17.78mmx20.32mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 16
Pitch 0.026 0.65mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS StatusROHS3 Compliant
In-Stock:1480 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.267110$5.26711
10$4.968971$49.68971
100$4.687709$468.7709
500$4.422367$2211.1835
1000$4.172044$4172.044

About PA0193

The PA0193 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features TSSOP-16-EXP-PAD TO DIP-16 SMT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PA0193, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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