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PA0186

PA0186

PA0186

Chip Quik Inc.

TO-263-7 DDPAK/D2PAK TO DIP-14

SOT-23

PA0186 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Package Accepted TO-263 (DDPAK/D2PAK)
Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 0.700 17.78mmx17.78mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 7
Pitch 0.050 1.27mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS StatusROHS3 Compliant
In-Stock:1308 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.290000$5.29
10$4.990566$49.90566
100$4.708081$470.8081
500$4.441586$2220.793
1000$4.190175$4190.175

About PA0186

The PA0186 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features TO-263-7 DDPAK/D2PAK TO DIP-14.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PA0186, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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